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HDI

HDI
  • FR4
  • 10 Layers
  • Blind & Burried holes
  • L1~L5+L6~L10+L1~10
  • Immersion Gold
  • Controlled Impedance
HDI
  • Rogers RO4003C + RO4450B
  • 4 Layers
  • Blind / Burried vias
  • L1~L2,L1~L4, L2~L4
  • Minimum line width/spacing by 5/2 mil
  • epoxy filled for vias
  • vias to be copper paste filled
HDI
  • FR4
  • 6 Layers
  • Blind / Burried vias
  • L2~L5,L1~L6,L1~L2,L5~L6
  • vias to be copper filled
  • castellation hole plating
  • impedance
  • Minimum line width/spacing by 3/2 mil
HDI
  • Rigid-Flex(HDI)
  • 6 Layers,Rigid 4L,Flex 2L
  • Board thinkness 0.5mm
  • 1+1+2b+1+1
  • trace width 3/3mil
  • copper thickness 1.0mil
  • Blind & Burried holes

Real Time Focus Technology Corp., was one of the worldwide(world's) premier contract manufacturing companies who was offer online PCB assembly, prototyping and manufacturing services in European, America and Asian market. We look forward to earning your production and quick turn prototype Printed Circuit Board fabrication business. If you have any questions or would like a formal quote,Contact Us for more information.

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