| Laminate Material |
Base Material |
FR-4 TG135, TG150, TG170 |
| CEM1 |
| CEM3 |
| Rogers 3, 4 and 5 series |
| Arlon |
| Nelco 4000-13 |
| Alμminμm - 2 L |
| Ceramic |
| Kapton |
| BT Material |
| Material Thickness |
3~240 mil( 0.076 mm ~ 6 mm ) |
| Max. finished board |
457 x 533mm( 18" X 21") - Mass-Production |
| 355.6 x 736.6 mm ( 14" X 29") - Samples |
| Min. board Thickness |
4mil. (0.1mm)-2L |
| 14mils ( 0.4 mm ) - 4 L |
| 20mils( 0.5 mm ) - 6 L |
| Max. / Min. Layer |
1 ~ 20L - Mass-Pro. |
| 22 ~ 26 L - Samples |
| Cu. Thickness |
0.3 ~ 10 Oz - Mass-Pro. |
| Pattern Design |
Min. Line-width |
3 mils ( 0.076 mm ) -Mass-Production. |
| Min Spacing |
3 mils ( 0.076 mm ) -Mass-Production |
| Image Distortion |
(+/- 20%) |
| Gold Thickness Range |
3~50μ" |
| Open / Short |
YES |
| Bow & Twist |
0.75% |
| Solder mask |
Type Available |
Taiyo, Tamura, Onstatic |
| Green, Black, Blue, Red, White, Purple, Clear |
| Solder mask Registration tol. |
+/-2 mil |
| Min.Width S/M Bridge |
3mil for green |
| PeelableMask |
PeelableMask Type |
Peters SD2955, SD2954,SD2952 |
| PeelableMask Thickness |
200μm |
| Tolerance |
Routing |
+/- 0.005" |
| Feature to Hole |
+/- 4 mil |
| Hole to Hole |
+/-3 mil |
| Punching |
+/- 4 mil |
| V-Cut |
V-grove Depth |
+/-10% |
| Min. Unit / Panel size |
100 mm |
| Min. Unit / Panel thick. |
3.2 mm |
| Surface Treatment |
HASL Thickness Range |
80~1000 μ" |
| Entek Thickness Range |
0.2~0.3 μm |
| Electroless Nickel Thickness |
100~250 μ" |
| Electroless Gold Thickness |
2~10μ" Max |
| Wire Bonding Gold Thickness |
4~10μ" Max |
| Lead Free HASL |
80~1000 μ" |
| Immersion Silver |
6 ~12 μ" |
| Immersion Tin |
30~40 μ"(Include copper) |
| 15~20 μ"(Tin only) |
| Flux Thickness Range |
none |
| Carbon Print Thickness |
per resistor request |
| Carbon Print Res. |
per request |
| Drilling |
Min. Final Hole Size |
6 mils ( 0.15 mm ) - Mechnical |
| Size |
4 mils ( 0.1 mm ) -Laser Drill |
| Hole size tol. |
PTH ±3 mil (+/-2mil for Press Fit ) |
| NPTH ±2 mil |
| Hole location tol. |
+/-2 mil |
| Layer to layer |
+/-2 mil |
| Registration tol. |
|
| Fiducial Mark Tolerance |
+/-20% |
| Board flatness Tolerance |
0.75% |
| Special Requirement |
Epoxy In Holes |
|
| Vias In pad |
|
| Blind/Buried Vias(HDI process) |
2+nb+2，1+1+1+2b+1+1+1 |
| Special Requirement |
|
