產品介紹
瑞太福科技股份有限公司擁有多年及持續快速發展的PCB印刷電路板製造之經驗。
我們為客戶提供專業的PCB印刷電路板製造及更專注於PCB樣品。
瑞太福科技股份有限公司是您值得信賴的夥伴,我們可以為您提供優良的PCB印刷電路板製造服務。
當您選擇PCB印刷電路板製造商時,請不要猶豫,將我們的服務考慮在內。
身為一個領先的PCB印刷電路板製造商,瑞太福科技股份有限公司提供全球客戶具有更高之耐用性及可靠性的PCB印刷電路板樣品之生產及服務。
此外,在各種不同的應用領域,例如汽車產品,LED產品,HDI,記憶體模組......等等,我們都能確保提供支援。
我們將為您提供品質最佳的客制化及最高性價比之產品。
作為PCB印刷電路板製造領域的領先供應商,我們特別提高專業及高品質的製造能力,從設計、製造、測試......等等,以滿足客戶的需求。
憑藉良好的聲譽,我們高度重視與主要客戶和潛在客戶建立合作關係,以增進彼此的市場競爭力。
瑞太福科技股份有限公司會是您的最佳選擇。
通訊商品
- FR4
- 6 Layers
- 0.062”(1.6mm)Thick
- 3μ”Immersion Gold (Component Side)
- 30μ”Hard Gold Plating(Solder Side)
- Depth Controlled Blind Routing(L1~L3)
通訊用品
- Arlon AD250 PIM(Teflon Base)
- 1 Layers
- 0.062”(1.6mm)Thick
通訊用品
- Rogers RO4350 (Ceramic Base)
- 4 Layers
- 0.062”(1.6mm)Thick
Rogers RT 5880 (High TG/Low DK)
- Immersion silver
- Teflon base
- 2 Layers
- 125mil / 2oz~
Rogers Diclad 880
- Immersion silver
- 2 Layers
- 14mil
- Rogers Material for High Frequency Application
Rogers RO4003C + FR4 Tg 170 + None Flow Prepreg
- 4 Layers ( Build as 6 layers)
- Thickness: 0.059"+/-10%
- Blind via: L1-L2,L3-L4
- Epoxy filled in holes
- Blind route
- Immersion gold
軟板 Flexible Printed Circuit(FPC)
- Hard disk connect Board
- Electroless Nickel Immersion Gold(ENIG) Finished
- PI stiffner
軟板 Flexible Printed Circuit(FPC)
軟硬板結合 Rigid-Flex PCB
- L1/L2, L5/L6 Rigid board
- L3/L4 Flex board
- 6 Layers
- 0.062"(1.6mm)
LED 用品
- BT material
- 2 Layers
- 0.17mm Thick
- 4u” ENIG for wire bonding
LED 用品
- BT material
- 4 Layers
- 0.3mm Thick
- 12u” soft gold plating for wire bonding
LED 用品
- 2w/mk Aluminum
- Single Layer
- 48mil 1/0 oz
- Taiyo PSR-4000 white LPI
LED 用品
- FR-4
- Single Layer
- 40mil 1/0 oz
- Taiyo PSR-4000 white LPI
LED 用品
- Bendable Aluminum(2W/mk)
- 1.6mm
- 1/0oz
- Flexible white solder mask
LED 用品
- FR4 Tg 170
- Mini LED( Thin board thickness)
- 2Layers
- Thickness: 0.2mm+/-0.03mm
- Minimum space 2.2mil
- SMD fine pitch control
- Dryfilm solder mask process
- Immersion Gold
LED 用品
- FR4 Tg 170
- Mini LED( Thin board thickness)
- 2Layers
- Thickness: 0.2mm+/-0.03mm
- Minimum space 2.2mil
- SMD fine pitch control
- Dryfilm solder mask process
- Immersion Gold
工業用產品
- FR4
- 18 Layers
- 0.200”(5mm)Thick
- 10μ”(Immersion Gold)
- Impedance
- Blind Routing
工業用產品
- FR4 Tg170
- 8 Layers
- 0.120”(4mm)Thick
- Non-Flow Prepreg
醫療用產品
- FR4 TG170
- 4 Layers
- 0.062”(1.6mm)Thick
- EPOXY in Holes
- Impedance Controlled
醫療用產品
- IS410 4 Layers
- 0.062”(1.6mm)Thick
- Immersion Silver
- Impedance controlled
醫療用產品
- FR4 Tg 170
- 14 Layers
- Thickness: 0.220”+/-10%
- Heavy copper
- Inner : 5 oz, External 6 oz finish
- Epoxy filled in holes
- Counersink holes
- Back drill
- Immersion Gold
HDI
- FR4
- 10 Layers
- Blind & Burried holes
- L1~L5+L6~L10+L1~10
- Immersion Gold
- Controlled Impedance
HDI
- Rogers RO4003C + RO4450B
- 4 Layers
- Blind / Burried vias
- L1~L2,L1~L4, L2~L4
- Minimum line width/spacing by 5/2 mil
- epoxy filled for vias
- vias to be copper paste filled
HDI
- FR4
- 6 Layers
- Blind / Burried vias
- L2~L5,L1~L6,L1~L2,L5~L6
- vias to be copper filled
- castellation hole plating
- impedance
- Minimum line width/spacing by 3/2 mil
HDI
- Rigid-Flex(HDI)
- 6 Layers,Rigid 4L,Flex 2L
- Board thinkness 0.5mm
- 1+1+2b+1+1
- trace width 3/3mil
- copper thickness 1.0mil
- Blind & Burried holes
車用產品
- FR4 Tg
- 2.4mm thick
- 4oz finish
- HASL
- press fit
- Matte green
車用產品
- Gas Semi Truck
- CAN module /CAN Bus
- FR4 Tg 150
- 2.0mm
- 1oz finish
- Immersion Tin
- press fit
車用產品
- FR4 Tg 150
- 2.4mm
- 3oz finish
- Immersion Tin
- press fit
- Three solder mask color : white, red, blue, matte black
車用產品
- FR4
- 6 Layers
- 0.134”(3.4mm) thick
- 4 oz copper
- Immersion Tin
- PTH hole +/-0.05mm for press-fit technology
車用產品
- FR4
- 4 Layers
- 0.093”(2.4mm) thick
- 3 oz copper
- Immersion Tin
- PTH hole +/-0.05mm for press-fit technology
伺服器用產品Server
- FR4
- 20 Layers
- 0.120"(3mm)Thick
軍用產品
- Rogers RO5880 (Teflon Base)
- 2 Layers
- 0.125"(3mm)Thick
- Immersion Silver
記憶體用模組
- FR4
- 8 Layers
- 0.048"(1.2mm)Thick
- Immersion Gold+30 μ" Gold Finger
陶瓷板PCB/陶瓷基板(DPC Process)
消費性產品
- FR4
- 6 Layers
- 0.062"(1.6mm)Thick
- Blind Vias(L1~L3)
- Peelable Solder Mask
消費性產品
- IC Packages
- FR4
- 2 Layers
- 0.004"(0.10mm)Thick
消費性產品(鋁基板/Aluminum)
- Aluminum Base
- 2 Layers
- 0.062”(1.6mm)Thick
- Lead Free HASL
消費性產品
- FR4
- 10 Layers
- 0.062”(1.6mm)Thick
- Impedance Controlled
- 3μ” Immersion Gold+30μ” Gold Finger
消費性產品(NELCO)
- NELCO N4000-13
- 6 Layers
- 0.062”(1.6mm)Thick
- HASL
- TG210
Communication PCB
- FR4 Tg 150
- 16 Layers
- Thickness: 0.108”+/-10%
- Blind via: L1-L2,L2-L15,L15-L16
- Laser via
- Epoxy filled in holes
- Back drilling
- Immersion gold
Communication PCB
- FR4 Tg 150
- 16 Layers
- Thickness: 0.108”+/-10%
- Blind via: L1-L2,L2-L15,L15-L16
- Laser via
- Epoxy filled in holes
- Back drilling
- Immersion gold
消費性產品
- Aluminum Base + FR4
- MP-06
- PCB Metal Core
- Power Supply
- 4L 1oz
- 0.062" thickness
- Immersion Gold
消費性產品
- FR4
- 4 Layers
- 0.062"(1.6mm)Thick
- 8μ“ Wire Bonding Gold(COB)
消費性產品
- FR4
- 6 Layers
- 0.040"(1.0mm)Thick
- L2~L5 Buried Vias
- L1~L2 / L5~L6 Laser Blind Micro Vias
消費性產品
- L1 / L2 Rogers RO4003(Ceramic Base)
- L3 / L4 FR4
- 4 Layers
- 0.062”(1.6mm)Thick
- 50μ” Full Body Hard Gold Plating
消費性產品
- FR4 TG170
- 14 Layers
- 0.094”(2.4mm) thick
- 1.5 oz copper
- Immersion Gold
- Impedance control
- Counter Sin
消費性產品
- FR4
- 8 Layers
- 0.048"(1.2mm)Thick
- HASL+30 μ ”Selective Hard Gold Plating
消費性產品
- FR4
- 6 Layers
- 0.062"(1.6mm)Thick
- Impedance Controlled
- Entek(OSP)+G/F(30μ")
消費性產品
- PA-07
- PCB Board Assembly
消費性產品
- PA-08
- PCB Board Assembly
消費性產品
- PA-09
- PCB Board Assembly
FR4 Tg 150 + PI + Coverylay + None Flow Prepreg
- 10 Layers
- Thickness: 2.1mm+/-10%
- Flex(L5-L6)+Rigid board
- Epoxy filled in holes
- Blind route
- Immersion Gold
- Control Impedance
FR4 Tg 150 + PI + Coverylay + None Flow Prepreg
- 4 Layers
- Thickness: 0.062"+/-10%
- Flex(L2-L3)+Rigid board
- Epoxy filled in holes
- Blind route
- Immersion Gold
- Control Impedance
TU993+
- 14 Layers
- Thickness: 0.082"+/-10%
- Buired via:
- L2-L13,L3-L12,L4-L11,L5-L10
- Epoxy filled in holes
- Immersion Silver
- Control Impedance